AUTOMATISCHE KAPSELMANIPULATIONSANLAGE ZUM BEFUELLEN UND ENTLEEREN VON BRENNKAPSELN MIT TELLERN = INSTALLATION AUTOMATIQUE D'ENCASTAGE-DECASTAGE D'ASSIETTESREICHL H.1979; BER. DTSCH. KERAM. GES.; ISSN 0365-9542; DEU; DA. 1979; VOL. 56; NO 8; PP. 217-218Article

LEISTUNGSGRENZEN MECHANISCHER SCHNELLDRUCKER. = LIMITES DES PERFORMANCES DES IMPRIMANTES MECANIQUES RAPIDESDIETL J; REICHL H.1976; F.U.M.; DTSCH.; DA. 1976; VOL. 84; NO 1; PP. 10-16Article

LIFETIME MEASUREMENTS IN SILICON EPITAXIAL MATERIALS.REICHL H; BERNT H.1975; SOLID-STATE ELECTRON.; G.B.; DA. 1975; VOL. 18; NO 5; PP. 453-458; ABS. ALLEM.; BIBL. 10 REF.Article

MEASUREMENT OF MINORITY CARRIER LIFETIME PROFILES IN SILICON.SCHWAB G; BERNT H; REICHL H et al.1977; SOLID-STATE ELECTRON.; G.B.; DA. 1977; VOL. 20; NO 2; PP. 91-94; H.T. 1; BIBL. 11 REF.Article

A METHOD TO DETERMINE MINORITY CARRIER LIFETIME IN GAAS LIGHT-EMITTING DIODESMUELLER J; REICHL H; BERNT H et al.1979; SOLID-STATE ELECTRON.; GBR; DA. 1979; VOL. 22; NO 3; PP. 257-260; BIBL. 9 REF.Article

MEASUREMENT OF MINORITY CARRIER LIFETIME AND DIFFUSION LENGTH IN SILICON EPITAXIAL LAYERS BY MEANS OF THE PHOTO CURRENT TECHNIQUEMUELLER J; BERNT H; REICHL H et al.1978; SOLID-STATE ELECTRON.; GBR; DA. 1978; VOL. 21; NO 8; PP. 999-1003; BIBL. 16 REF.Article

Optical in-situ measurement of the deposition rate during laserinduced depositionKRABE, D. B; REICHL, H.Experimentelle Technik der Physik. 1994, Vol 40, Num 1, pp 133-149, issn 0014-4924Article

High resolution neutron imaging for pulsed and constant load operation of passive self-breathing polymer electrolyte fuel cellsWEILAND, M; BOILLAT, P; OBERHOLZER, P et al.Electrochimica acta. 2013, Vol 87, pp 567-574, issn 0013-4686, 8 p.Article

Analysis of the friction processes in ultrasonic wedge/wedge-bondingGAUL, Holger; SCHNEIDER-RAMELOW, M; REICHL, H et al.Microsystem technologies. 2009, Vol 15, Num 5, pp 771-775, issn 0946-7076, 5 p.Article

Influence of structure dimensions on self-breathing micro fuel cellsWAGNER, S; KRUMBHOLZ, S; HAHN, R et al.Journal of power sources (Print). 2009, Vol 190, Num 1, pp 76-82, issn 0378-7753, 7 p.Conference Paper

Parametric FE-approach to flip-chip reliability under various loading conditionsWUNDERLE, B; NÜCHTER, W; SCHUBERT, A et al.Microelectronics and reliability. 2004, Vol 44, Num 12, pp 1933-1945, issn 0026-2714, 13 p.Conference Paper

Flip Chip Molding: High reliable Flip Chip encapsulationBRAUN, T; BECKER, K.-F; KOCH, M et al.Proceedings - Electronic Components Conference. 2002, pp 717-725, issn 0569-5503, isbn 0-7803-7430-4, 9 p.Conference Paper

Reliability assessment of flip-chip assemblies with lead-free solder jointsSCHUBERT, A; DUDEK, R; WALTER, H et al.Proceedings - Electronic Components Conference. 2002, pp 1246-1255, issn 0569-5503, isbn 0-7803-7430-4, 10 p.Conference Paper

High density pixel detector module using flip chip and thin film technologyWOLF, J; GERLACH, P; EHRMANN, O et al.SPIE proceedings series. 2000, pp 553-556, isbn 0-930815-60-2Conference Paper

Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technologyTOPPER, M; DIETRICH, L; ENGELMANN, G et al.SPIE proceedings series. 1999, pp 295-300, isbn 0-930815-57-2Conference Paper

System integration for high frequency applicationsWOLF, J; SCHMÜCKLE, F. J; HEINRICH, W et al.SPIE proceedings series. 1997, pp 29-36, isbn 0-930815-50-5Conference Paper

Reliability potential of epoxy based encapsulants for automotive applicationsBRAUN, T; BECKER, K.-F; KOCH, M et al.Microelectronics and reliability. 2005, Vol 45, Num 9-11, pp 1672-1675, issn 0026-2714, 4 p.Conference Paper

Development of a planar micro fuel cell with thin film and micro patterning technologiesHAHN, R; WAGNER, S; SCHMITZ, A et al.Journal of power sources. 2004, Vol 131, Num 1-2, pp 73-78, issn 0378-7753, 6 p.Conference Paper

Performance and thermo-mechanical reliability of micro-channel coolers : A parametric studyWUNDERLE, B; SCHACHT, R; WITTLER, O et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol2, 11-16Conference Paper

Comparison of HDI organic and LTCC substrate technology with its potential for RF module applicationSOMMER, G; FOTHERINGHAM, Gerhard; JOHN, W et al.SPIE proceedings series. 2003, pp 183-188, isbn 0-8194-5189-4, 6 p.Conference Paper

Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technologyTÖPPER, M; GERLACH, P; DIETRICH, L et al.The International journal of microcircuits and electronic packaging. 1999, Vol 22, Num 4, pp 305-311, issn 1063-1674Article

Low cost bumping by stencil printing : Process qualification for 200 μm pitchKLOESER, J; HEINRICHT, K; JUNG, E et al.SPIE proceedings series. 1998, pp 288-298, isbn 0-930815-52-1Conference Paper

Chip size package : The option of choice for miniaturized medical devicesTOPPER, M; SCHALDACH, M; EHRMANN, O et al.SPIE proceedings series. 1998, pp 749-754, isbn 0-930815-52-1Conference Paper

Electroless Plating on semiconductor wafersASCHENBRENNER, R; OSTMANN, A; REICHL, H et al.Proceedings - Electrochemical Society. 1998, pp 67-71, issn 0161-6374, isbn 1-56677-200-1Conference Paper

Thermal simulation of aluminum nitride heat spreaders for various advanced electronic packaging applicationsHAHN, R; KAMP, A; HOEHNE, J et al.Eurotherm series. 1998, pp 195-201, issn 1248-8313, isbn 2-84299-033-1Conference Paper